January 13, 2025
Questions concerning the limited submissions process may be submitted to limitedsubs@psu.edu.
No applicants. Please contact LimitedSubs@psu.edu if you wish to apply.
INFORMATIONAL WEBINAR: NIST will hold an informational webinar on November 8, 2024, from 2:00-3:00 Central. Register here.
PROPOSORS' DAY: On November 15, 2024, NIST will hold a Hybrid meeting for potential applicants to the CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) Notice of Funding Opportunity (NOFO). Register here.
NIST seeks applications for industry-informed, university-based artificial intelligence-powered autonomous experimentation (AI/AE) collaborations, including research and development, education and workforce development, and related activities relevant to sustainable semiconductor materials and processes. Through awards made under this Notice of Funding Opportunity (NOFO), the CHIPS Research and Development Office (CHIPS R&D) aims to achieve the following objectives:
1. Accelerate research into and delivery of targeted, industry-relevant, sustainable semiconductor materials and processes through the application of AI/AE;
2. Propagate models for incorporating sustainability metrics into semiconductor industry materials design and discovery, in addition to continued advancement in power, performance, area, cost, or other relevant technology metrics;
3. Expand the capabilities of emerging research institutions and other emerging R&D participants through cohesive, innovative teams of universities, industry, government labs, and other stakeholders; and
4. Build an exceptional workforce of university graduates and faculty with AI/AE R&D expertise.
If successful, CHIPS R&D investments under this NOFO should demonstrate that new sustainable semiconductor materials and processes, meeting industry needs, can be designed and adopted for industry testing within five years. Further, the investment should accelerate a step-change in the number of universities, researchers, and graduates participating in the U.S. semiconductor R&D ecosystem.
Operational Areas
Responsive applications to this NOFO must propose activities, milestones, and deliverables to address the following three Operational Areas (OAs):
OA1: Convening, Roadmapping, and Technology Transfer: Establishing lasting collaborations between stakeholders, refining Co-optimization and Programmatic Targets, and transferring research outputs for further use.
OA2: AI/AE Infrastructure and Research: Establishing AI/AE capabilities, to include infrastructure at ERIs and other research universities or access to such infrastructure, and conducting basic and applied research into early TRL materials and processes that address semiconductor industry needs.
OA3: Education and Workforce Development: Developing and expanding the total number of domestic researchers skilled in AI/AE methods relevant to the semiconductor industry materials and processes.
Institutional Limitation
Penn State may submit only one concept paper and, if invited, one full application as the lead institution. However, Penn State may participate in multiple applications as a sub-recipient.
Award amount
Awards between $20,000,00 and $40,000,000 for up to five years.
Cost Share
Non-federal cost share is not required in this program. However, CHIPS R&D encourages applicants to detail in their applications opportunities for optional co-investment, which may include industry-provided expertise, intellectual property, facility access, or other forms of partner co-investment during the award period of performance.
Sponsor Review Criteria
The CHIPS R&D merit review process will assess concept papers against the following five criteria: (1) relevance to economic and national security; (2) overall scientific and technical merit; (3) project management; (4) transition and impact strategy; and (5) education and workforce development.
Submission Timeline
Informational Webinar: November 8, 2024
Proposers’ Day Meeting: November 15, 2024
Concept paper deadline: January 13, 2025.
Invited Full Applications Due: Full application deadlines will be communicated to invited applicants at the time of invitation.
Recurrence of Opportunity
We don't have enough information from the funder to assess whether this opportunity is likely to be renewed in future or not.
| This announcement provides only opportunity highlights. Please carefully review the sponsor's website for any requirements and expectations related to eligibility, budget, collaboration, priority research areas, letter of intent requirements, and review criteria before submitting to this internal downselect. |